Abstract: Increasing demand for DRAM scaling and high-bandwidth has driven DRAM technology to 3D/2.5D integration. With the innovative Hybrid Bonding technology, a new Stacked Embedded DRAM (SEDRAM) ...
Abstract: Stacked intelligent metasurfaces (SIM) have recently emerged as a promising technology, which can realize transmit precoding in the wave domain. In this letter, we investigate a SIM-aided ...
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